In case you didn’t know, Intel processors currently use a organic substrate. The one who basically It is the circuit board on which the silicon chip is installed which contains the electronic circuitry of the cores, called DIE.
This organic substrate has been refined over time and enhanced with an integrated multi-die connecting bridge (Embedded multi-die connection bridge or EMIB). However, this will change later because Intel has announced that it will produce processors with a glass substrate.
Let’s remember this Organic substrates reach the limits of their physical resilience. Thus Intel has invested heavily in finding a replacement This will improve the packaging of advanced chips and the investment will begin to bear fruit.
Intel Glass Substrate Features
Unlike the previously mentioned organic substrate currently used by processors, glass offers several novelties. Some of them are a extreme thinness, better thermal and mechanical stability, resulting in a much higher interconnect density on a substrate. Let’s not forget that higher performance can be achieved with higher transistor density in the CPUs.
These advantages will enable chip architects to create high-density, high-performance chip packages for data-intensive workloads such as artificial intelligence (AI). Aside from that, Glass substrates tolerate higher temperatures, offer 50% less circuit distortion, and a 10-fold increase in interconnect density is possible on glass substrates.
One of the first applications of the glass substrate will be Data center processors. However, glass substrates is applied to other markets that can benefit from its use, such as artificial intelligence and graphics.
When will glass substrate solutions come?
In this sense, the Intel company is on the way to bringing complete glass substrate solutions to the market. in the second half of this decade (between 2025 and 2029)which will allow the industry to continue advancing Moore’s Law beyond 2030.
